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Redesign of the Subassembly Leads to $4 Million in Cost Savings

Situation

A medical device company, encountered quality and delivery issues with a crucial imaging subassembly sourced from an external supplier, impacting the overall product quality and availability.

Actions

MetaExpert Stan proposed an internal redesign of the subassembly instead of relying on the supplier. The cross-functional development spanned semiconductor chip design, electrical, mechanical, software engineering, and manufacturing engineering, including post-processing algorithms. A custom CMOS imaging device was created, leading to the development of a new, more efficient subassembly with better yield, quality, and cost.

Results

The redesign resulted in an annual savings of $4 million for the company, halving the subassembly cost and resolving all quality issues. The project also improved the performance and availability of components, contributing to an estimated $200 million in annual revenue from the larger product sales.

Return on Investment

With a project cost of $1.5 million and annual savings of $4 million, the ROI was substantial, demonstrating the value of in-house development and control over key components.

Breakthrough in medical device imaging subassembly

Conclusion

The project was a resounding success, demonstrating the benefits of internal innovation and interdisciplinary collaboration. It not only saved significant costs but also enhanced the performance of a critical medical device component, ensuring the continued success and market leadership of the client in digital radiography.

Project Details

MetaExpert skills needed:

  • Semiconductor design and characterization
  • Electrical and mechanical engineering
  • Software and firmware development
  • Manufacturing engineering process control
  • Project management
  • Interdisciplinary communication

Contract Length: 18 months, completed on time, leading to subsequent projects.

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